What is the recommended maximum value for bonding resistance in OSP applications?

In outside plant (OSP) applications, maintaining low bonding resistance is critical for effective grounding and lightning protection. A maximum bonding resistance of 0.1 Ohms is generally recommended. This low value ensures that electrical faults or surges can be safely and effectively dissipated into the ground, minimizing the risk of equipment damage and maintaining the safety of personnel.

The rationale behind this low threshold is primarily related to the need for reliable operation of protective devices and to ensure that the grounding system can quickly channel current away from sensitive equipment or personnel. Higher resistance values might impede the grounding system’s effectiveness, increasing the risk of voltage buildup during electrical events such as lightning strikes or power surges.

Ensuring that bonding resistance is kept at or below this maximum recommended value helps to protect infrastructure and personnel from electrical faults, contributing to a safer and more reliable OSP environment.